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IPC-7530

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Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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群焊工艺温度曲线指南(再流焊和波峰焊)
在群焊过程中,所有焊点均达到最低焊接(再流焊)温度是重要的以确保焊料合金和被焊基底金属之间形成冶金结合而达到焊接。冶金结合要求被焊接的两表面以及焊料需达到最低焊接温度并且维持充足的时间,以使焊料表面润湿。本文件提供了适当的温度曲线测试工具与有关温度曲线的各种技术和方法指南。共18页, 于2001年5月发行。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 7530
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level 0
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