Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common defects which can be attributed to profiling. 42 pages. Released March 2017
SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
Document Number | 7530 |
Publication Date | Not Available |
Language | en - English |
Page Count | |
Revision Level | A |
Supercedes | |
Committee |