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IPC-7525B

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Stencil Design Guidelines

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模板设计指导
中文描述 本文件为设计与制造焊膏及表面贴装胶用模板提供 指导以及采用通孔或者倒装芯片器件的混装技术模 板设计,其中包括锡铅和无铅焊膏、套印、二次印 刷和阶梯模板设计之间的差别。该文件同时提供了 样品定购单和用户检验检查表

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 7525
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-7525C Revision
Not Available IPC-7525B Revision
Not Available IPC-7525 Revision
Not Available IPC-7525C Revision
Not Available IPC-7525B Revision
Not Available IPC-7525B RU Revision
Not Available IPC-7525B Revision
Not Available IPC-7525A DE Revision