Logo

IPC-7095C

Current Revision

Design and Assembly Process Implementation for BGAs

$183.00

$215.00

$258.70


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


Stay effortlessly up-to-date with the latest standard revisions. When new versions are released, they're automatically charged and delivered to you, ensuring seamless compliance.

Document Preview Not Available...

Design and Assembly Process Implementation for BGAs
Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures. The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly.In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 7095
Publication Date Not Available
Language en - English
Page Count
Revision Level C
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-7095C Revision
Not Available IPC-7095B Revision
Not Available IPC-7095A Revision
Not Available IPC-7095 Revision
Not Available IPC-7095D-WAM1 Consolidated
Not Available IPC-7095C Revision
Not Available IPC-7095D-WAM1 Consolidated
Not Available IPC-7095D-WAM1 Consolidated