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IPC-7094A

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Design and Assembly Process Implementation for Flip Chip and Die-Size Components

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Design and Assembly Process Implementation for Flip Chip and Die-Size Components - English
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and reliability issues associated with flip chip and die-size package technologies, including wafer-level ball grid array (WLBGA). It provides useful and practical information to those who mount bare-die or die-size components in a DCA assembly or those who are considering flip chip process implementation.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 7094
Publication Date Not Available
Language en - English
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-7094A Revision
Not Available IPC-7094 Revision