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IPC-7091A

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Design and Assembly Process Implementation of 3D Components

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Design and Assembly Process Implementation of 3D Components
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 7091
Publication Date Not Available
Language en - English
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-7091A Revision
Not Available IPC-7091 Revision