Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating of filled holes, copper filled microvias and therma shock. For use with IPC-6011 and IPC-6018. Supersedes IPC-6018CS.
| SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
| Document Number | 6018 |
| Publication Date | Not Available |
| Language | en - English |
| Page Count | |
| Revision Level | D |
| Supercedes | |
| Committee |