Logo

IPC-6018DS

Current Addendum

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

$55.00

$64.00

$77.35


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


Document Preview Not Available...

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating of filled holes, copper filled microvias and therma shock. For use with IPC-6011 and IPC-6018. Supersedes IPC-6018CS.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 6018
Publication Date Not Available
Language en - English
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-6018D Revision
Not Available IPC-6018C Revision
Not Available IPC-6018B Revision
Not Available IPC-6018A Revision
Not Available IPC-6018 Revision
Not Available IPC-6018C Revision
Not Available IPC-6018B Revision