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IPC-6018C

Historical Revision

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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高频(微波)印制板的鉴定及性能规范
本规范涵盖了高频(微波)印制板鉴定和性能要求,包括有或无镀覆孔的单面板、双面板、含或不含埋孔/盲孔及金属芯的多层板。该标准涉及最终涂覆层和表面电镀涂覆层要求、导体、通孔/导通孔、验收测试的频次和质量一致性、电气与机械及环境要求。C版本在诸如HASL涂层、可选的表面镀层、边缘电镀、标记、微导通孔捕获和目标连接盘、铜盖覆电镀填塞孔、铜填充微孔、PTFE钻污和介质去除等领域中加入了许多新的要求。与IPC-6011一起使用。取代IPC-6018B和IPC-6016。 2017年12月翻译。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 6018
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level C
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-6018D Revision
Not Available IPC-6018C Revision
Not Available IPC-6018B Revision
Not Available IPC-6018A Revision
Not Available IPC-6018 Revision
Not Available IPC-6018C Revision
Not Available IPC-6018B Revision