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IPC-6015

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Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

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Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures
Establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly. Includes the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011. 25 pages. Released February 1998.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 6015
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-6015 Revision