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IPC-6013E

Historical Revision

Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

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挠性和刚挠印制板的鉴定及性能规范
涵盖根据 IPC-2221 和 IPC-2223 设计的挠性印制板的鉴定和性能要求。 挠性印刷板可以是单面、双面、多层或刚挠性多层。所有这些结构都可以包括增强板、镀覆孔、微导通孔和盲孔/埋孔。 修订版 E 包含了对最终涂覆、刚挠过渡区、外来夹杂物、表面贴装焊盘异常、电镀内层、褶皱、折痕和吸管状空隙等形变异常,标记,重合度(孔环),导体厚度减小,孔壁介质去除,树脂去除,微孔填镀和孔选择性(钮扣)镀等、铜填充通孔结构微导通孔结构的新增和更新要求。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 6013
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level E
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-6013E Revision
Not Available IPC-6013D Revision
Not Available IPC-6013C Revision
Not Available IPC-6013B Revision
Not Available IPC-6013A Revision
Not Available IPC-6013 Revision
Not Available IPC-6013E Revision
Not Available IPC-6013D Revision
Not Available IPC-6013D Revision
Not Available IPC-6013B CN Revision
Not Available IPC-6013A DE Revision