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IPC-6012E-AM1

Historical Amendment

Space and Military Avionics Applications Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards

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Qualification and Performance Specification for Rigid Printed Boards
IPC-6012E-AM1 is an Amendent to the IPC-6012E that clarifes the distinction between receding and dewetting solder in reflowed SPb or HASL coatings. The Amendment also provides amended criteria for minimum external conductor thickness of the finished printed board and new acceptance criteria for the minimum thickness of internal plated layers

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 6012
Publication Date Not Available
Language en - English
Page Count
Revision Level E
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-6012F Revision
Not Available IPC-6012E Revision
Not Available IPC-6012D Revision
Not Available IPC-6012C Revision
Not Available IPC-6012B Revision
Not Available IPC-6012A Revision
Not Available IPC-6012 Revision
Not Available IPC-6012F Revision
Not Available IPC-6012F Revision
Not Available IPC-6012E Revision
Not Available IPC-6012E Revision
Not Available IPC-6012E Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012C Revision
Not Available IPC-6012C Revision
Not Available IPC-6012C DE Revision
Not Available IPC-6012C CN Revision
Not Available IPC-6012C Revision
Not Available IPC-6012B IT Revision
Not Available IPC-6012B Revision
Not Available IPC-6012B DE Revision