Qualification and Performance Specification for Rigid Printed Boards
IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012E incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D.
SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
Document Number | 6012 |
Publication Date | Not Available |
Language | en - English |
Page Count | |
Revision Level | E |
Supercedes | |
Committee |