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IPC-6012D-AM1

Historical Amendment

Space and Military Avionics Applications Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards

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Qualification and Performance Specification for Rigid Printed Boards
The IPC-6012D-AM1 makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6012D. The IPC-6012D-AM1 implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after January 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with adopting acceptance requirements proven on newer designs. The IPC-6012D-AM1 is not applicable to legacy product that will remain subject to IPC-6012D copper wrap plating requirements.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 6012
Publication Date Not Available
Language en - English
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-6012F Revision
Not Available IPC-6012E Revision
Not Available IPC-6012D Revision
Not Available IPC-6012C Revision
Not Available IPC-6012B Revision
Not Available IPC-6012A Revision
Not Available IPC-6012 Revision
Not Available IPC-6012F Revision
Not Available IPC-6012F Revision
Not Available IPC-6012E Revision
Not Available IPC-6012E Revision
Not Available IPC-6012E Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012D Revision
Not Available IPC-6012C Revision
Not Available IPC-6012C Revision
Not Available IPC-6012C DE Revision
Not Available IPC-6012C CN Revision
Not Available IPC-6012C Revision
Not Available IPC-6012B IT Revision
Not Available IPC-6012B Revision
Not Available IPC-6012B DE Revision