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IPC-TR-579

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Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

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Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 579
Publication Date Not Available
Language en - English
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Not Available IPC-TR-579 Revision