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IPC-TR-484

Current Revision

Results of IPC Copper Foil Ductility Round Robin Study

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Results of IPC Copper Foil Ductility Round Robin Study
Results of IPC Copper Foil Ductility Round Robin Study

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 484
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available IPC-TR-484 Revision