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IPC-4821

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Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent. It provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor materials. The document shall be used as a qualification and conformance standard for these materials. This document contains material designation, conformance (requirements), qualification (characterization) and quality assurance specifications. This document covers the requirements for dielectric, conductive, and insulating materials that are used with materials for the manufacture of printed circuit boards containing embedded passive capacitor functionality. 34 pages. Released May 2006.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4821
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Committee
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Not Available IPC-4821 Revision