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IPC-HDBK-4691

Historical Revision

Handbook on Adhesive Bonding in Electronic Assembly Operations

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电子组件操作用粘合剂粘接手册
本手册的目的是帮助那些必须选择粘合剂粘接或从事粘合剂粘接操作的个人,还为仅涉及电子组装的粘合剂粘接的设计、选型和使用提供指导

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4691
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level 0
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Committee
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