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IPC-HDBK-4691

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Handbook on Adhesive Bonding in Electronic Assembly Operations

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Handbook on Adhesive Bonding in Electronic Assembly Operations
This handbook assists individuals who make choices regarding adhesive bonding or who must work in adhesive bonding operations for electronic assemblies. The full-color guide also provides guidelines for design, selection and application of adhesive bonding.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4691
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Committee
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