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IPC-4563

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Resin Coated Copper Foil for Printed Boards Guideline

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Resin Coated Copper Foil for Printed Boards Guideline
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4563
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available IPC-4563 Revision