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IPC-4556-AM1

Current Amendment

is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

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is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment 1
IPC-4556-AM1 is the amendment 1 to the standard IPC-4556 and made the following changes to the base specification: a) It added the absolute value of the maximum thickness for the immersion gold of 0.070 μm [2.8 μin] that accompanies the statistically valid minimum immersion gold thickness; b) It added two more photomicrograph images to provide better information on identifying nickel hyper corrosion; c) It added the basis of determining both the minimum as well as maximum values of immersion gold thickness with ENEPIG surface finish; d) It added the statement that using statistical process control is encouraged but not mandatory with this surface finish; e) It provided two alternate methods for deposition of thicker gold compared to strictly immersion gold; and f) It better defines how the C=0 sampling plan is to be utilized such that it will conform to this surface finishes' requirements.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4556
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-4556 Revision
Not Available IPC-4556 Revision