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IPC-4552B

Historical Revision

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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印制板化学镀镍/ 浸金(ENIG)镀覆性能规范
本性能规范为化学镀镍 / 浸金(ENIG)在包括焊接、金属线键合和作为一种接触表面的应用设置了相应的沉积厚度要求。适用于化学药水供应商、印制板制造商、电子制造服务业(EMS)和原始设备制造商(OEM)。本标准可用于除了那些符合 IPC-6010 系列(IPC-6012、IPC-6013 和 IPC-6018)标准性能要求外的指定的验收标准。使用本规范规定的化学镀镍 / 浸金(ENIG)沉积层也满足 J-STD-003 印制电路板的可焊性规范中涂层耐久性的最高等级要求。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4552
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-4552B Revision
Not Available IPC-4552A Revision
Not Available IPC-4552 Revision
Not Available IPC-4552-WAM1&2 Consolidated
Not Available IPC-4552B Revision
Not Available IPC-4552A Revision
Not Available IPC-4552 DE Revision