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IPC-4552A

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Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
The IPC-4552A performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. The IPC-4552A is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM). The IPC-4552A standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010-FAM Printed Board Performance Specifications. The ENIG deposit specified by using this document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability specification. The IPC-4552A specification is based on three critical factors:

  1. The ENIG plating process is in control producing a normal distribution for nickel and gold deposit thickness.
  2. That the tool used to measure the deposit and therefore control the process is accurate and reproducible for the thickness range specified.
  3. That the ENIG plating process results in uniform deposit characteristics.
If any of these three critical factors are not met, then the deposit produced will not meet the performance criteria defined.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4552
Publication Date Not Available
Language en - English
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-4552B Revision
Not Available IPC-4552A Revision
Not Available IPC-4552 Revision
Not Available IPC-4552-WAM1&2 Consolidated
Not Available IPC-4552B Revision
Not Available IPC-4552A Revision
Not Available IPC-4552 DE Revision