Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
The IPC-4552A performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. The IPC-4552A is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM). The IPC-4552A standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010-FAM Printed Board Performance Specifications. The ENIG deposit specified by using this document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability specification.
The IPC-4552A specification is based on three critical factors:
SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
Document Number | 4552 |
Publication Date | Not Available |
Language | en - English |
Page Count | |
Revision Level | A |
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Committee |