Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-4204B establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed boards. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from polyesters, polyimides, liquid crystal polymers and at least nine versions of polymer adhesives as well as adhesiveless bonding agents. The net result of these material combinations provide the industry with suitable clad, flexible dielectrics for fabricating flexible printed board interconnections. IPC-4204B also addresses how to utilize legacy designs that refer to earlier, out-of-date material designations
SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
Document Number | 4204 |
Publication Date | Not Available |
Language | en - English |
Page Count | |
Revision Level | B |
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Committee |