Logo

IPC-4203A

Historical Revision

Cover and Bonding Material for Flexible Printed Circuitry

$149.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


Stay effortlessly up-to-date with the latest standard revisions. When new versions are released, they're automatically charged and delivered to you, ensuring seamless compliance.

Document Preview Not Available...

Cover and Bonding Material for Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides. These materials are to be used as cover material for flexible printed circuitry as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. The standard does not address nonflexible adhesives designed to be used in the rigid board areas of rigid flex constructions which are addressed in IPC-4101. Materials such as liquid-applied covercoat are delineated in IPC-SM-840 and are excluded from this document. The requirements herein meet or exceed the requirements for Class 3 which, in turn, meet or exceed conformance to Classes 1 and 2. 44 pages. Released January 2013. Included in the C-102 and C-1000 Collections.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4203
Publication Date Not Available
Language en - English
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-4203B Revision
Not Available IPC-4203A Revision
Not Available IPC-4203 Revision