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IPC-4101C

Historical Revision

Specification for Base Materials for Rigid and Multilayer Printed Boards

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Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 66 individual specification sheets that can be searched using key words. These key words allow the document's user to find materials of a similar nature, but with specific differing properties that fine-tune their laminate and/or prepreg selection needs. This revision's 11 new specification sheets reflect the expanded offerings for current commercially available laminates and prepregs. These 11 new specification sheets add laminate and prepreg materials to this document that have improved or additional properties that include one or more of the following: low halogen content, lead-free applications, high thermal performance or high speed/high frequency performance. 137 pages. Released August 2009.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4101
Publication Date Not Available
Language en - English
Page Count
Revision Level C
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-4101E Revision
Not Available IPC-4101D Revision
Not Available IPC-4101C Revision
Not Available IPC-4101B Revision
Not Available IPC-4101A Revision
Not Available IPC-4101 Revision
Not Available IPC-4101E-WAM1 Consolidated
Not Available IPC-4101D-WAM1 Consolidated
Not Available IPC-4101E Revision
Not Available IPC-4101C Revision
Not Available IPC-4101C Revision
Not Available IPC-4101B WAM 1 and 2-DE Consolidated