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IPC-D-355

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Printed Board Automated Assembly Description in Digital Form

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Printed Board Automated Assembly Description in Digital Form
Describes an intelligent, digital data transfer format for describing component mounting information. Supplements IPC-D-350 and is for designers and assemblers. Data included are pin location, component orientation, etc. This document is frozen; no future updates are planned. 33 pages. Released January 1995.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number D355
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available IPC-D-355 Revision