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IPC-3408

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General Requirements for Anisotropically Conductive Adhesives Films

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General Requirements for Anisotropically Conductive Adhesives Films
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product. 25 pages. Released November 1996.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 3408
Publication Date Not Available
Language en - English
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