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IPC-D-279

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Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

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Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; environmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns. 137 pages. Released July 1996.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number D279
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-D-279 Revision