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IPC-2225

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Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

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Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
Used in conjunction with IPC-2221A, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties and relationships with DFM and DFE. 44 pages. Released May 1998.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 2225
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-2225 Revision