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IPC-2223D

Historical Revision

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

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Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision D provides new design guidance and requirements for material selection and construction, selective (button) plating, minimum bending for flexible circuits with coverlay, impedance and capacitance control, unsupported edge conductors/fingers and copper filled vias/microvias.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 2223
Publication Date Not Available
Language en - English
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-2223E Revision
Not Available IPC-2223D Revision
Not Available IPC-2223C Revision
Not Available IPC-2223B Revision
Not Available IPC-2223A Revision
Not Available IPC-2223 Revision
Not Available IPC-2223E Revision
Not Available IPC-2223C CN Revision
Not Available IPC-2223C DE Revision
Not Available IPC-2223B DE Revision
Not Available IPC-2223A Revision