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IPC-2222B

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Sectional Design Standard for Rigid Organic Printed Boards

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刚性有机印制板设计分标准
IPC-2222 与 IPC-2221 一起使用,确立了刚性有机印制板和其他形式的元件安装和互连结构设计的具体要求。本标准适用于单面、双面或多层板。本文档中的关键概念是:刚性层压板特性、印制板组装的设计要求和孔/互连的设计要求。修订版B为层压板选择、刻痕和布线参数、印制板厚度公差、非功能性焊盘、孔纵横比、通孔尺寸和印制板边缘间距提供了新的设计指南和要求。2020年10月发布。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 2222
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-2222B Revision
Not Available IPC-2222A Revision
Not Available IPC-2222 Revision
Not Available IPC-2222B Revision
Not Available IPC-2222B Revision
Not Available IPC-2222A Revision
Not Available IPC-2222A-CN Revision
Not Available IPC-2222A DE Revision
Not Available IPC-2222 DE Revision
Not Available IPC-2222 CN Revision