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IPC-2222B

Current Revision

Sectional Design Standard for Rigid Organic Printed Boards

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Sectional Design Standard for Rigid Organic Printed Boards
IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The IPC-2222B standard applies to single-sided, double-sided, or multi-layered boards. Key concepts in IPC-2222B are rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections. Revision B provides new design guidance and requirements for laminate selection, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios, via hole size and printed board edge spacing.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 2222
Publication Date Not Available
Language en - English
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-2222B Revision
Not Available IPC-2222A Revision
Not Available IPC-2222 Revision
Not Available IPC-2222B Revision
Not Available IPC-2222B Revision
Not Available IPC-2222A Revision
Not Available IPC-2222A-CN Revision
Not Available IPC-2222A DE Revision
Not Available IPC-2222 DE Revision
Not Available IPC-2222 CN Revision