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IPC-2222A

Historical Revision

Sectional Design Standard for Rigid Organic Printed Boards

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Sectional Design Standard for Rigid Organic Printed Boards
Used in conjunction with IPC-2221, IPC-2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections. Revision A provides new design guidance and requirements for dielectric spacing, lead-free laminate materials, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios and clearance areas in planes.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 2222
Publication Date Not Available
Language en - English
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-2222B Revision
Not Available IPC-2222A Revision
Not Available IPC-2222 Revision
Not Available IPC-2222B Revision
Not Available IPC-2222B Revision
Not Available IPC-2222A Revision
Not Available IPC-2222A-CN Revision
Not Available IPC-2222A DE Revision
Not Available IPC-2222 DE Revision
Not Available IPC-2222 CN Revision