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IPC-1602

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Standard for Printed Board Handling and Storage

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Standard for Printed Board Handling and Storage
The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called out within procurement documentation. The IPC-1602 standard provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, moisture concerns for etched cores and composites, desiccant material and HIC cards, and example of flow downs of packaging and handling requirements.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 1602
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-1602 Revision
Not Available IPC-1602 Revision