Logo

IPC-1601A

Current Revision

Printed Board Handling and Storage Guidelines

$103.00

$121.00

$145.60


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


Stay effortlessly up-to-date with the latest standard revisions. When new versions are released, they're automatically charged and delivered to you, ensuring seamless compliance.

Document Preview Not Available...

Printed Board Handling and Storage Guidelines
The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. Revision A provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, mositure concerns for etched cores and composites, desiccant material and HIC cards, and example flowdowns of packaging and handling requirements. Superseded by IPC-1602

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 1061
Publication Date Not Available
Language en - English
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-1601A Revision
Not Available IPC-1601 Revision
Not Available IPC-1601A Revision
Not Available IPC-1601A Revision
Not Available IPC-1601A Revision
Not Available IPC-1601A Revision
Not Available IPC-1601 Revision
Not Available IPC-1601 Revision