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IPC-HDBK-005

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Guide to Solder Paste Assessment

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焊膏评估指南
本手册是焊膏标准J-STD-005的配套文件,应该视为帮助评估焊膏在表面贴装(SMT)工艺中使用的适用性指南。本文件还提出了一些可有助于设计和测试焊膏的测试方法。它旨在供焊膏供应商和用户使用。本文件作为指南而编写,以评估用于特定工艺的焊膏的适用性,给出了当前可用的不同材料、环境和工艺变量的大量组合

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 5
Publication Date Not Available
Language zh - Chinese
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Revision Level 0
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Not Available IPC-HDBK-005 Revision
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