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IPC-0040

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Optoelectronic Assembly and Packaging Technology

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Optoelectronic Assembly and Packaging Technology - Single User Download
This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly. 163 pages. Released May 2003. Preview the table of contents .pdf file.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 40
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Committee
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Not Available IPC-0040 Revision