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IPC ECA/IPC/JEDEC-J-STD-075

Historical Revision

Classification of Passive and Solid State Devices for Assembly Processes

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组装工艺中非IC电子元器件的分级
简要介绍 (英文)J-STD-075主要涵盖了J-STD-020未涉及的内容,所提供的测试方法可针对电子元器件在最坏情况下对焊接组装工艺的限制进行分级,分级时采用常见的波峰焊和再流焊工艺曲线,包括无铅工艺。分级代表最高的工艺敏感等级,并没有为组装厂建立返工条件或推荐工艺。它概述了非半导体元器件工艺敏感等级(PSL)的分级和标识程序,潮湿敏感等级(MSL)符合半导体行业的分级(J-STD-020《非气密固态表面贴装器件潮湿/再流焊敏感度分级》和J-STD-033《潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用》)。J-STD-075取代IPC-9503。由ECA、IPC和JEDEC联合开发。全文共12页,于2008年8月发布。2010年9月出版其中文版。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J075
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level 0
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Publish Date Document Id Type View
Not Available EIA/IPC/JEDEC-J-STD-075A Revision
Not Available ECA/IPC/JEDEC-J-STD-075 Revision
Not Available ECA/IPC/JEDEC-J-STD-075 Revision
Not Available ECA/IPC/JEDEC-J-STD-075 Revision
Not Available ECA/IPC/JEDEC-J-STD-075 Revision