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IPC EIA/IPC/JEDEC-J-STD-002D

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Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

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元器件引线、焊端、焊片、端子和导线的可焊性测试
本标准规定了用于评估电子元器件引线、焊端、实芯导线、多股导线、焊片和接触片可焊性的测试方法、缺陷定义及验收标准,并附有相关图表。本标准还包括金属层耐溶蚀性/退润湿的测试方法。本标准适用于供应商和用户。J-STD-002D由EIA、IPC和JEDEC开发。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J002
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available EIA/IPC/JEDEC-J-STD-002E Revision
Not Available EIA/IPC/JEDEC-J-STD-002D Revision
Not Available EIA/IPC/JEDEC-J-STD-002E Revision
Not Available EIA/IPC/JEDEC-J-STD-002E Revision
Not Available EIA/IPC/JEDEC-J-STD-002D Revision
Not Available EIA/IPC/JEDEC-J-STD-002C-WAM1 Consolidated