Logo

IPC EIA/IPC/JEDEC-J-STD-002D

Historical Revision

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

$143.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


Stay effortlessly up-to-date with the latest standard revisions. When new versions are released, they're automatically charged and delivered to you, ensuring seamless compliance.

Document Preview Not Available...

EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by EIA, IPC and JEDEC. 49 pages. Released June 2013.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J002
Publication Date Not Available
Language en - English
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available EIA/IPC/JEDEC-J-STD-002E Revision
Not Available EIA/IPC/JEDEC-J-STD-002D Revision
Not Available EIA/IPC/JEDEC-J-STD-002E Revision
Not Available EIA/IPC/JEDEC-J-STD-002E Revision
Not Available EIA/IPC/JEDEC-J-STD-002D Revision
Not Available EIA/IPC/JEDEC-J-STD-002C-WAM1 Consolidated