EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by EIA, IPC and JEDEC. 49 pages. Released June 2013.
SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
Document Number | J002 |
Publication Date | Not Available |
Language | en - English |
Page Count | |
Revision Level | D |
Supercedes | |
Committee |