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IPC EIA/IPC/JEDEC-J-STD-002E

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Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

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Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
IPC-J-STD-002E prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of metallization. IPC-J-STD-002E is intended for use by both supplier and user. The IPC-J-STD-002E standard was developed by ECIA, IPC and JEDEC.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J002
Publication Date Not Available
Language en - English
Page Count
Revision Level E
Supercedes
Committee
Publish Date Document Id Type View
Not Available EIA/IPC/JEDEC-J-STD-002E Revision
Not Available EIA/IPC/JEDEC-J-STD-002D Revision
Not Available EIA/IPC/JEDEC-J-STD-002E Revision
Not Available EIA/IPC/JEDEC-J-STD-002E Revision
Not Available EIA/IPC/JEDEC-J-STD-002D Revision
Not Available EIA/IPC/JEDEC-J-STD-002C-WAM1 Consolidated