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IEEE 1386.1-2001

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IEEE Standard Physical and Environmental Layers for PCI Mezzanine Cards: PMC

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New IEEE Standard - Inactive-Withdrawn. This standard, in conjunction with IEEE Std 1386-2001, IEEE Standard for a Common Mezzanine Card (CMC) Family, defines the physical and environmental layers of a PCI mezzanine card (PMC) family to be usable on (but not limited to) single slot VME, VME64 and VME64x boards,Compact PCI boards, Multibus I and Multibus II boards, desktop computers, portable computers,servers, and similar types of applications. The electrical and logical layers are based on the PCI specification from the PCI Special Interest Group. The PCI mezzanine cards allow for a variety of optional function expansions for the host system. I/O functionality from the PMC may be either through the mezzanine front panel, or via the backplane by routing the I/O signals through the mezzanine connector to the host.
Define a family of high speed low profile modular mezzanine cards for VMEbus, Futurebus+(R) desktop computers, and other computer systems with the logical and electrical layers based on PCI Special Interest Group's PCI Specification, Rev 2. The proposed Common Mezzanine Card (CMC) Family standard will be referenced for the mechanical layer. The environmental layer will be specified by the working group.
PCI (peripheral component interface) is a newly defined high speed local bus being used by several CISC and RISC microprocessors. PCI specification defines a 4.2 inch by 12.3 inch board that plugs into a motherboard in a perpendicular fashion. These perpendicular boards are not usable in many computer applications because they use too much vertical space. This proposed standard will define the mechanics of a low profile modular horizontal mezzanine card family that uses the logical and electrical layers of the PCI specification for the local bus. I/O can be via the front panel and/or through the connector to the host computer for rear panel I/O. The proposed CMC family mechanics will be used for the mechanical layer.

SDO IEEE: Institute of Electrical and Electronics Engineers
Document Number 1386.1
Publication Date Aug. 21, 2001
Language en - English
Page Count 14
Revision Level
Supercedes
Committee Microprocessor Standards Committee
Publish Date Document Id Type View
Aug. 21, 2001 1386.1-2001 Revision