New IEEE Standard - Inactive-Withdrawn.
Withdrawn Standard. Withdrawn Date: Jan 15, 2001. No longer endorsed by the IEEE. The mechanical design requirements for conduction-cooled and air-cooled modules of the 10SU by 6.375 in (161.9 mm) format are established. The specification of dimensions and tolerances is intended to ensure the mechanical intermateability of modules within associated subracks. The basic dimension, frames, PWBs, materials, assembly, and chassis interface of single-sided and double-sided modules are covered.
This standard establishes the mechanical design requirements for conduction-cooled and air-cooled modules of the 10 SU by 6.375 in [161.9 mm] format. This standard is intended for use in conjunction with other IEEE standards.
The purpose of this standard is the specification of dimensions and tolerances that will ensure the mechanical intermateability of modules within associated subracks. This standard covers the basic dimensions, frames, PWBs, materials, assembly, and chassis interface of single-sided and double-sided modules.
SDO | IEEE: Institute of Electrical and Electronics Engineers |
Document Number | 1101.3 |
Publication Date | Aug. 25, 1993 |
Language | en - English |
Page Count | 31 |
Revision Level | |
Supercedes | |
Committee | Microprocessor Standards Committee |