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BSI PD IEC TR 63378-1:2021

Current Revision

Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages.

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BGA, QFP type semiconductor packages.

SDO BSI: British Standards Institution
Document Number PD IEC TR 63378
Publication Date Jan. 11, 2022
Language en - English
Page Count 24
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Jan. 11, 2022 PD IEC TR 63378-1:2021 Revision