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BSI BS IEC 63011-2:2018

Current Revision

Integrated circuits. Three dimensional integrated circuits. Alignment of stacked dies having fine pitch interconnect.

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Integrated circuits. Three dimensional integrated circuits. Alignment of stacked dies having fine pitch interconnect.

SDO BSI: British Standards Institution
Document Number BS IEC 63011-2
Publication Date Jan. 24, 2019
Language en - English
Page Count 16
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Jan. 24, 2019 BS IEC 63011-2:2018 Revision