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BSI BS IEC 62047-27:2017

Current Revision

Semiconductor devices. Micro-electromechanical devices

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Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT).

SDO BSI: British Standards Institution
Document Number BS IEC 62047-27
Publication Date July 22, 2020
Language en - English
Page Count 20
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
July 22, 2020 BS IEC 62047-27:2017 Revision