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BSI BS EN 61190-1-3:2002

Current Revision

Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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ALLOYS and FLUXED and NON-FLUXED S

SDO BSI: British Standards Institution
Document Number BS EN 61190
Publication Date Aug. 12, 2002
Language en - English
Page Count 38
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Aug. 12, 2002 BS EN 61190-1-3:2002 Revision