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BSI BS EN 61190-1-2:2014

Current Revision

Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly

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Requirements for soldering pastes for high-quality interconn

SDO BSI: British Standards Institution
Document Number BS EN 61190
Publication Date June 30, 2014
Language en - English
Page Count 26
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
June 30, 2014 BS EN 61190-1-2:2014 Revision
July 31, 2007 BS EN 61190-1-2:2007 Revision
Aug. 12, 2002 BS EN 61190-1-2:2002 Revision