BSI |
BS EN 61189-3 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards) |
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BSI |
BS EN 61189-2 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures |
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IEC |
IEC 61189-3 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
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IEC |
IEC 61189-2 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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BSI |
BS EN 61189-5 |
Test methods for electrical materials, interconnection structures and assemblies. Test methods for printed board assemblies |
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BSI |
BS EN 61189-1 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods and methodology |
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IEC |
IEC 61189-5 |
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
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BSI |
BS EN 61189-5-1 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies |
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BSI |
BS IEC 61189-2-801 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies.Thermal conductivity test for base materials. |
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BSI |
BS IEC 61189-5-2 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies |
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BSI |
BS EN 61189-5-2 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies |
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BSI |
BS EN 61189-5-3 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies |
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BSI |
BS IEC 61189-5-3 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies |
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IEC |
IEC 61189-5-1 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
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IEC |
IEC 61189-5-2 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
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IEC |
IEC 61189-5-3 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
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IEC |
IEC 61189-2-801 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials |
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BSI |
PD IEC/TS 61189-3-301 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB |
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IEC |
IEC 61189-2-803 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards |
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BSI |
BS IEC 61189-2-804 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies.Test methods for time to delamination. T260, T288, T300. |
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IEC |
IEC 61189-2-805 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA |
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BSI |
BS EN 61189-5-4 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
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BSI |
BS IEC 61189-5-4 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
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IEC |
IEC/TS 61189-3-301 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB |
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IEC |
IEC 61189-2-804 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 |
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IEC |
IEC 61189-5-301 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles |
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BSI |
BS EN 61189-6 |
Test methods for electrical materials, interconnection structures and assemblies. Test methods for materials used in manufacturing electronic assemblies |
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IEC |
IEC 61189-5-4 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
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IEC |
IEC 61189-2-807 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA |
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BSI |
BS EN 61189-11 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys |
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IEC |
IEC 61189-2-808 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method |
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IEC |
IEC 61189-5-504 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) |
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IEC |
IEC 61189-1 |
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
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BSI |
BS EN 61189-2-719 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz) |
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IEC |
IEC 61189-2-630 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures Moisture absorption after pressure vessel conditioning |
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IEC |
IEC 61189-6 |
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
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IEC |
IEC 61189-5-502 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies |
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IEC |
IEC 61189-11 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
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BSI |
PD IEC/TR 61189-3-914 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines |
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IEC |
IEC 61189-5-601 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards |
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IEC |
IEC 61189-5-503 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
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IEC |
IEC 61189-3-913 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs |
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IEC |
IEC 61189-5-501 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes |
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IEC |
IEC 61189-2-719 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) |
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IEC |
IEC 61189-2-501 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials |
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IEC |
IEC/TR 61189-3-914 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines |
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IEC |
IEC 61189-2-720 |
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance |
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BSI |
BS EN 61189-3-719 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling |
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IEC |
IEC 61189-2-809 |
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA |
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IEC |
IEC 61189-3-719 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling |
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BSI |
BS EN 61249-2-22 |
Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad |
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BSI |
BS EN 61249-2-21 |
Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad |
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BSI |
BS EN 61249-2-23 |
Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad |
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BSI |
BS EN 61249-2-6 |
Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad |
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BSI |
BS EN 61249-2-5 |
Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad |
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BSI |
BS EN 61249-2-2 |
Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad |
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BSI |
BS EN 61249-2-11 |
Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad |
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