BSI |
BS EN 61189-2-719 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz) |
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IEC |
IEC 61189-2-719 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) |
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BSI |
BS EN 61189-2 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures |
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BSI |
BS EN 61189-3 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards) |
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BSI |
BS IEC 61189-2-801 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies.Thermal conductivity test for base materials. |
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IEC |
IEC 61189-2 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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IEC |
IEC 61189-3 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
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BSI |
BS EN 61189-1 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods and methodology |
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BSI |
BS EN 61189-5-1 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies |
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IEC |
IEC 61189-2-801 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials |
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BSI |
BS EN 61189-5 |
Test methods for electrical materials, interconnection structures and assemblies. Test methods for printed board assemblies |
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IEC |
IEC 61189-5-1 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
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BSI |
BS IEC 61189-5-2 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies |
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BSI |
BS EN 61189-5-2 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies |
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BSI |
BS EN 61189-5-3 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies |
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BSI |
BS IEC 61189-5-3 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies |
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BSI |
BS EN 61189-2-721 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator |
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IEC |
IEC 61189-5 |
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
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BSI |
BS IEC 61189-2-804 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies.Test methods for time to delamination. T260, T288, T300. |
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IEC |
IEC 61189-5-2 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
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IEC |
IEC 61189-5-3 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
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IEC |
IEC 61189-2-721 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator |
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IEC |
IEC 61189-5-502 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies |
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IEC |
IEC 61189-2-804 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 |
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BSI |
PD IEC/TR 61189-3-914 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines |
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BSI |
PD IEC/TS 61189-3-301 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB |
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BSI |
BS EN 61189-11 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys |
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IEC |
IEC 61189-2-808 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method |
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IEC |
IEC 61189-5-504 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) |
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IEC |
IEC 61189-2-803 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards |
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BSI |
BS IEC 61189-5-4 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
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BSI |
BS EN 61189-5-4 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
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IEC |
IEC 61189-11 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
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IEC |
IEC 61189-5-601 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards |
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IEC |
IEC 61189-2-805 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA |
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IEC |
IEC 61189-5-501 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes |
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IEC |
IEC 61189-5-301 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles |
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IEC |
IEC 61189-5-503 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
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IEC |
IEC 61189-3-913 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs |
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IEC |
IEC 61189-5-4 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
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IEC |
IEC/TR 61189-3-914 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines |
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IEC |
IEC/TS 61189-3-301 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB |
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IEC |
IEC 61189-2-807 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA |
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IEC |
IEC 61189-2-501 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials |
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IEC |
IEC 61189-1 |
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
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